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Charge deposition model for investigating SE-microdose effect in trench power MOSFETs
It was demonstrated that heavy ions can induce large current-voltage (I-V) characteristics shift in commercial trench power MOSFETs, named single event microdose effect (SE-microdose effect). A model is pre- sented to describe this effect. This model calculates the charge deposition by a single heav...
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Published in: | Journal of semiconductors 2015-05, Vol.36 (5), p.31-36 |
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container_end_page | 36 |
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container_title | Journal of semiconductors |
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creator | 万欣 周伟松 刘道广 薄涵亮 许军 |
description | It was demonstrated that heavy ions can induce large current-voltage (I-V) characteristics shift in commercial trench power MOSFETs, named single event microdose effect (SE-microdose effect). A model is pre- sented to describe this effect. This model calculates the charge deposition by a single heavy ion hitting oxide and the subsequent charge transport under an electric field. Holes deposited at the SiO2/Si interface by a Xe ion are calculated by using this model. The calculated results were then used in Sentaurus TCAD software to simulate a trench power MOSFET's I-V curve shift after a Xe ion has hit it. The simulation results are consistent with the related experiment's data. In the end, several factors which affect the SE-microdose effect in trench power MOSFETs are investigated by using this model. |
doi_str_mv | 10.1088/1674-4926/36/5/054003 |
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fullrecord | <record><control><sourceid>proquest_chong</sourceid><recordid>TN_cdi_chongqing_primary_664673450</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><cqvip_id>664673450</cqvip_id><sourcerecordid>1800465193</sourcerecordid><originalsourceid>FETCH-LOGICAL-c387t-239b5e3aead49b854bc887a6916852717e9eb4baf3c69bc9658fb357cb77b98c3</originalsourceid><addsrcrecordid>eNqFkE1LAzEURWehoFZ_ghDc6GZs0nwvpdQPqLhQ1yHJvGlT2smYTBX_vSkVcSG4Cu9xbrjvVNU5wdcEKzUmQrKa6YkYUzHmY8wZxvSgOv7ZH1UnOa8wLjMjx9XrdGnTAlADfcxhCLFDm9jAGrUxodC9Qx7Cwg6hW6DnWb0JPsUmZkDQtuCHQqAhQeeXqI8fkNDj0_Pt7CWfVoetXWc4-35H1WtZT-_r-dPdw_RmXnuq5FBPqHYcqAXbMO0UZ84rJa3QRCg-kUSCBsecbakX2nktuGod5dI7KZ1Wno6qq_2_fYpv29LVbEL2sF7bDuI2G6IwZoITTQvK92i5IOcErelT2Nj0aQg2O3Vmp8jsFBkqDDd7dSVH9rkQe7OK29SVg_7NXP6RWcX8mzJ90xby4rvVMnaLt6L5p5YQTEjKOKZfUjeK9w</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1800465193</pqid></control><display><type>article</type><title>Charge deposition model for investigating SE-microdose effect in trench power MOSFETs</title><source>Institute of Physics:Jisc Collections:IOP Publishing Read and Publish 2024-2025 (Reading List)</source><creator>万欣 周伟松 刘道广 薄涵亮 许军</creator><creatorcontrib>万欣 周伟松 刘道广 薄涵亮 许军</creatorcontrib><description>It was demonstrated that heavy ions can induce large current-voltage (I-V) characteristics shift in commercial trench power MOSFETs, named single event microdose effect (SE-microdose effect). A model is pre- sented to describe this effect. This model calculates the charge deposition by a single heavy ion hitting oxide and the subsequent charge transport under an electric field. Holes deposited at the SiO2/Si interface by a Xe ion are calculated by using this model. The calculated results were then used in Sentaurus TCAD software to simulate a trench power MOSFET's I-V curve shift after a Xe ion has hit it. The simulation results are consistent with the related experiment's data. In the end, several factors which affect the SE-microdose effect in trench power MOSFETs are investigated by using this model.</description><identifier>ISSN: 1674-4926</identifier><identifier>DOI: 10.1088/1674-4926/36/5/054003</identifier><language>eng</language><publisher>Chinese Institute of Electronics</publisher><subject>Charge deposition ; charge deposition model ; Computer simulation ; Electric power generation ; Mathematical models ; MOSFETs ; SE-microdose effect ; Semiconductors ; SiO2 ; trench power MOSFETs ; Trenches ; Volt-ampere characteristics ; 充电 ; 剂量效应 ; 功率MOSFET ; 沉积模式 ; 沟槽 ; 电荷沉积 ; 计算结果</subject><ispartof>Journal of semiconductors, 2015-05, Vol.36 (5), p.31-36</ispartof><rights>2015 Chinese Institute of Electronics</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c387t-239b5e3aead49b854bc887a6916852717e9eb4baf3c69bc9658fb357cb77b98c3</citedby><cites>FETCH-LOGICAL-c387t-239b5e3aead49b854bc887a6916852717e9eb4baf3c69bc9658fb357cb77b98c3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Uhttp://image.cqvip.com/vip1000/qk/94689X/94689X.jpg</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids></links><search><creatorcontrib>万欣 周伟松 刘道广 薄涵亮 许军</creatorcontrib><title>Charge deposition model for investigating SE-microdose effect in trench power MOSFETs</title><title>Journal of semiconductors</title><addtitle>Chinese Journal of Semiconductors</addtitle><description>It was demonstrated that heavy ions can induce large current-voltage (I-V) characteristics shift in commercial trench power MOSFETs, named single event microdose effect (SE-microdose effect). A model is pre- sented to describe this effect. This model calculates the charge deposition by a single heavy ion hitting oxide and the subsequent charge transport under an electric field. Holes deposited at the SiO2/Si interface by a Xe ion are calculated by using this model. The calculated results were then used in Sentaurus TCAD software to simulate a trench power MOSFET's I-V curve shift after a Xe ion has hit it. The simulation results are consistent with the related experiment's data. In the end, several factors which affect the SE-microdose effect in trench power MOSFETs are investigated by using this model.</description><subject>Charge deposition</subject><subject>charge deposition model</subject><subject>Computer simulation</subject><subject>Electric power generation</subject><subject>Mathematical models</subject><subject>MOSFETs</subject><subject>SE-microdose effect</subject><subject>Semiconductors</subject><subject>SiO2</subject><subject>trench power MOSFETs</subject><subject>Trenches</subject><subject>Volt-ampere characteristics</subject><subject>充电</subject><subject>剂量效应</subject><subject>功率MOSFET</subject><subject>沉积模式</subject><subject>沟槽</subject><subject>电荷沉积</subject><subject>计算结果</subject><issn>1674-4926</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2015</creationdate><recordtype>article</recordtype><recordid>eNqFkE1LAzEURWehoFZ_ghDc6GZs0nwvpdQPqLhQ1yHJvGlT2smYTBX_vSkVcSG4Cu9xbrjvVNU5wdcEKzUmQrKa6YkYUzHmY8wZxvSgOv7ZH1UnOa8wLjMjx9XrdGnTAlADfcxhCLFDm9jAGrUxodC9Qx7Cwg6hW6DnWb0JPsUmZkDQtuCHQqAhQeeXqI8fkNDj0_Pt7CWfVoetXWc4-35H1WtZT-_r-dPdw_RmXnuq5FBPqHYcqAXbMO0UZ84rJa3QRCg-kUSCBsecbakX2nktuGod5dI7KZ1Wno6qq_2_fYpv29LVbEL2sF7bDuI2G6IwZoITTQvK92i5IOcErelT2Nj0aQg2O3Vmp8jsFBkqDDd7dSVH9rkQe7OK29SVg_7NXP6RWcX8mzJ90xby4rvVMnaLt6L5p5YQTEjKOKZfUjeK9w</recordid><startdate>20150501</startdate><enddate>20150501</enddate><creator>万欣 周伟松 刘道广 薄涵亮 许军</creator><general>Chinese Institute of Electronics</general><scope>2RA</scope><scope>92L</scope><scope>CQIGP</scope><scope>W92</scope><scope>~WA</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>20150501</creationdate><title>Charge deposition model for investigating SE-microdose effect in trench power MOSFETs</title><author>万欣 周伟松 刘道广 薄涵亮 许军</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c387t-239b5e3aead49b854bc887a6916852717e9eb4baf3c69bc9658fb357cb77b98c3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2015</creationdate><topic>Charge deposition</topic><topic>charge deposition model</topic><topic>Computer simulation</topic><topic>Electric power generation</topic><topic>Mathematical models</topic><topic>MOSFETs</topic><topic>SE-microdose effect</topic><topic>Semiconductors</topic><topic>SiO2</topic><topic>trench power MOSFETs</topic><topic>Trenches</topic><topic>Volt-ampere characteristics</topic><topic>充电</topic><topic>剂量效应</topic><topic>功率MOSFET</topic><topic>沉积模式</topic><topic>沟槽</topic><topic>电荷沉积</topic><topic>计算结果</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>万欣 周伟松 刘道广 薄涵亮 许军</creatorcontrib><collection>维普_期刊</collection><collection>中文科技期刊数据库-CALIS站点</collection><collection>维普中文期刊数据库</collection><collection>中文科技期刊数据库-工程技术</collection><collection>中文科技期刊数据库- 镜像站点</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Journal of semiconductors</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>万欣 周伟松 刘道广 薄涵亮 许军</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Charge deposition model for investigating SE-microdose effect in trench power MOSFETs</atitle><jtitle>Journal of semiconductors</jtitle><addtitle>Chinese Journal of Semiconductors</addtitle><date>2015-05-01</date><risdate>2015</risdate><volume>36</volume><issue>5</issue><spage>31</spage><epage>36</epage><pages>31-36</pages><issn>1674-4926</issn><abstract>It was demonstrated that heavy ions can induce large current-voltage (I-V) characteristics shift in commercial trench power MOSFETs, named single event microdose effect (SE-microdose effect). A model is pre- sented to describe this effect. This model calculates the charge deposition by a single heavy ion hitting oxide and the subsequent charge transport under an electric field. Holes deposited at the SiO2/Si interface by a Xe ion are calculated by using this model. The calculated results were then used in Sentaurus TCAD software to simulate a trench power MOSFET's I-V curve shift after a Xe ion has hit it. The simulation results are consistent with the related experiment's data. In the end, several factors which affect the SE-microdose effect in trench power MOSFETs are investigated by using this model.</abstract><pub>Chinese Institute of Electronics</pub><doi>10.1088/1674-4926/36/5/054003</doi><tpages>6</tpages></addata></record> |
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subjects | Charge deposition charge deposition model Computer simulation Electric power generation Mathematical models MOSFETs SE-microdose effect Semiconductors SiO2 trench power MOSFETs Trenches Volt-ampere characteristics 充电 剂量效应 功率MOSFET 沉积模式 沟槽 电荷沉积 计算结果 |
title | Charge deposition model for investigating SE-microdose effect in trench power MOSFETs |
url | http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-27T07%3A32%3A08IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_chong&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Charge%20deposition%20model%20for%20investigating%20SE-microdose%20effect%20in%20trench%20power%20MOSFETs&rft.jtitle=Journal%20of%20semiconductors&rft.au=%E4%B8%87%E6%AC%A3%20%E5%91%A8%E4%BC%9F%E6%9D%BE%20%E5%88%98%E9%81%93%E5%B9%BF%20%E8%96%84%E6%B6%B5%E4%BA%AE%20%E8%AE%B8%E5%86%9B&rft.date=2015-05-01&rft.volume=36&rft.issue=5&rft.spage=31&rft.epage=36&rft.pages=31-36&rft.issn=1674-4926&rft_id=info:doi/10.1088/1674-4926/36/5/054003&rft_dat=%3Cproquest_chong%3E1800465193%3C/proquest_chong%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c387t-239b5e3aead49b854bc887a6916852717e9eb4baf3c69bc9658fb357cb77b98c3%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=1800465193&rft_id=info:pmid/&rft_cqvip_id=664673450&rfr_iscdi=true |