Plasma Enhanced Chemical Vapour Deposition （PECVD） at Atmospheric Pressure （AP） of Organosilicon Films for Adhesion Promotion on Ti15V3Cr3Sn3Al and Ti6Al4V

The recent generation of aircraft is manly built out of CRFP （Carbon fiber reinforced plastic）. To ensure galvanic compatibility Titanium alloys are used at connecting points to metallic structures. The increased use of Titanium alloys due to their good mechanical properties has highlighted the need...

Full description

Saved in:
Bibliographic Details
Published in:材料科学与工程：中英文A版 2015 (7), p.274-284
Main Author: Jana Haag Tobias Mertens Max Kolb Liliana Kotte Stefan Kaskel
Format: Article
Language:Chinese
Subjects:
AP
PECVD
Ti6Al4V
大气压力
有机硅膜
碳纤维增强塑料
等离子体增强化学气相沉积
附着力促进剂
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The recent generation of aircraft is manly built out of CRFP （Carbon fiber reinforced plastic）. To ensure galvanic compatibility Titanium alloys are used at connecting points to metallic structures. The increased use of Titanium alloys due to their good mechanical properties has highlighted the need for structural bonding as joining method to combine Titanium with CFRP. However, long-term stable adhesion on Titanium is still an issue. Currently mainly wet-chemical processes are applied to improve adhesion on Titanium alloys. Since wet-chemical treatments often comprise the use of hazardous chemicals dry environmentally friendly surface functionalization processes are pushed more into focus. PECVD （Plasma enhanced chemical vapour deposition） at AP （Atmospheric pressure） seems to be favorable for the deposition of silicon dioxide films as an adhesion promoter layer. In the present work, the deposition of silicon dioxide adhesion layer （from HMDSO （Hexamethyldisiloxane） as precursor） on titanium alloys is descri
ISSN:2161-6213