Parallel Process 3D Metal Microprinting

• Published in: Advanced materials technologies 2019-01, Vol.4 (1), p.n/a
• Main Authors: Lin, Yen‐Po, Zhang, Yong, Yu, Min‐Feng
• Format: Article
• Language: English
• Subjects: electrodeposition; metal 3D printing; parallel process manufacturing
• ISSN: 2365-709X; 2365-709X
• DOI: 10.1002/admt.201800393

3D printing, as an additive manufacturing technology, enables agile and free‐form fabrication of complex 3D structures relevant to industrial application. However, the 3D structure forming mechanisms in existing 3D printing technologies hinder and even prevent the manufacturing of ultra‐precision 3D metal parts, let alone parallel process manufacturing. A generic 3D electrochemical microprinting technology that allowed the “printing” of ultrahigh density, ultrahigh aspect ratio, and electronics quality 3D copper structures with microscale and even nanoscale precision in an ambient environment is developed here. Further on, the feedback‐controlled and self‐regulated “printing” mechanism was demonstrated to be capable of realizing parallel process 3D “printing” of an array of identical copper microstructures simultaneously, promising large‐scale 3D printing–based production of precision metal structures for broad applications in 3D integration of electronics and sensor systems. 3D electrochemical microprinting technology demonstrates the “printing” of ultrahigh density, ultrahigh aspect ratio, and electronics quality 3D copper structures with microscale and even nanoscale precision, and enables the parallel process “printing” of an array of copper microstructures simultaneously, promising large‐scale 3D printing–based manufacturing of precision metal structures for broad applications.