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3D Printed Polyimide Nanocomposite Aerogels for Electromagnetic Interference Shielding and Thermal Management
Aerogels were listed among the top ten emerging technologies in chemistry by IUPAC in 2022. Their record‐breaking properties sparked the emergence of a thriving insulation market, but solutions are sought to promote additional applications. A 3D assembly process based on direct ink writing of “aerog...
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Published in: | Advanced materials technologies 2023-07, Vol.8 (14), p.n/a |
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Main Authors: | , , , , , , , , , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Aerogels were listed among the top ten emerging technologies in chemistry by IUPAC in 2022. Their record‐breaking properties sparked the emergence of a thriving insulation market, but solutions are sought to promote additional applications. A 3D assembly process based on direct ink writing of “aerogel‐in‐aerogel” nanocomposites is presented. The printed polyimide‐silica aerogels are non‐brittle (E = 6.7 MPa) with a super‐insulating thermal conductivity (20.3 mW m−1 K−1) and high thermal stability (T5wt% 447 °C). In addition, they display excellent low‐loss dielectric properties and microwave transmission over all relevant communication bands and can be functionalized for electromagnetic interference (EMI) shielding. The high shape‐fidelity printing, combined with laser‐induced etching of thermally conductive graphene layers, enable precise thermal management for portable electronics or maintain an extreme temperature gradient (−40 to +50°C) across a millimeter‐scale partition.
Additive manufacturing and composition optimization (polyimide‐silica formulation optionally functionalized with rGO, CNT, or laser‐induced carbonization) are applied to achieve the multi‐functional spatial assembly of polyimide aerogel composites. The composite aerogels present superb thermal, mechanical and dielectric properties, demonstrating their potential applications in thermal management and electromagnetic interference shielding. |
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ISSN: | 2365-709X 2365-709X |
DOI: | 10.1002/admt.202202155 |