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Anomalous Elastic Evolution Induced by Copper Hopping in van der Waals Ferroelectric CuInP 2 S 6

Van der Waals (vdW) ferroelectric CuInP 2 S 6 (CIPS) has great potential in post‐Moore's law electronics owing to their advantages of weak interlayer interaction, stable surface with free dangling bonds, and robust switchable spontaneous polarization. The flexoelectric effect is demonstrated as...

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Bibliographic Details
Published in:Advanced electronic materials 2023-12, Vol.9 (12)
Main Authors: Shao, Minghao, Yang, Yuzhe, He, Ri, Zhao, Ruiting, Renshaw Wang, X., Zhong, Zhicheng, Liu, Houfang, Yang, Yi, Ren, Tian‐Ling
Format: Article
Language:English
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Summary:Van der Waals (vdW) ferroelectric CuInP 2 S 6 (CIPS) has great potential in post‐Moore's law electronics owing to their advantages of weak interlayer interaction, stable surface with free dangling bonds, and robust switchable spontaneous polarization. The flexoelectric effect is demonstrated as an alternative switching method for the design of ferroelectric domains in layered vdW CIPS. However, the investigation of the correlation between the polarization and elastic properties remains indistinct. Here, an elastic evolution is explored experimentally and theoretically in layered vdW CIPS with temperature, of which Young's modulus ( E Young ) is determined by analyzing the force‐indentation responses of vdW ferroelectric CIPS. Interestingly, an anomalous leap in E Young of CIPS from 35 to 65 GPa occurs when the temperature rises across the Curie temperature T C of ≈315 K. Deep potential molecular dynamic (DPMD) simulations identify that this abnormal behavior can be attributed to temperature‐dependent change of copper distribution and the local copper dynamic hopping, intertwined with the order‐disorder ferroelectric phase transition, which is quite different from the typical decrease of E Young in the lattice constant due to temperature increasing. The exploration provides an important reference for the analysis of coupled mechanical properties and ferroelectricity in CIPS and its applications in flexible electronics.
ISSN:2199-160X
2199-160X
DOI:10.1002/aelm.202300352