Photosensitive polynorbornene based dielectric. I. Structure-property relationships

In the microelectronics industry, the drive for increasing device speed, level of functionality and shrinking size has placed significant demands on the performance characteristics of polymer dielectrics. In this study, a negative acting, photodefinable dielectric formulation based on a copolymer of...

Full description

Saved in:
Bibliographic Details
Published in:Journal of applied polymer science 2004-03, Vol.91 (5), p.3023-3030
Main Authors: Bai, Yiqun, Chiniwalla, Punit, Elce, Edmund, Shick, Robert A., Sperk, James, Allen, Sue Ann Bidstrup, Kohl, Paul A.
Format: Article
Language:English
Subjects:
Applied sciences
crosslinking
dielectric properties
Exact sciences and technology
Physicochemistry of polymers
Polymer industry, paints, wood
structure-property relations
Technology of polymers
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:In the microelectronics industry, the drive for increasing device speed, level of functionality and shrinking size has placed significant demands on the performance characteristics of polymer dielectrics. In this study, a negative acting, photodefinable dielectric formulation based on a copolymer of decylnorborne (decylNB) and epoxynorbornene (AGENB) was investigated for use in electronics packaging. The structure–property relations of this copolymer were investigated. Copolymer composition and processing conditions were shown to significantly affect the properties of the final polymer films. A lower content of AGENB results in lower moisture absorption, dielectric constant, modulus and residual stress, but it compromises multilayer capability. High crosslink density lowers the dielectric constant but increases the modulus and residual stress. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 91: 3023–3030, 2004
ISSN:0021-8995
1097-4628
DOI:10.1002/app.13531