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The effect of loading on μTBS of four all-in-one adhesives on bonding to dentin

This in vitro study analyzed the effect of mechanical loading on microtensile bond strength (μTBS) to dentin of four all‐in‐one adhesives and compared with a total‐etch adhesive system. The tested adhesives were Danville Experimental (an unfilled single‐component adhesive containing a proprietary or...

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Bibliographic Details
Published in:Journal of biomedical materials research. Part B, Applied biomaterials Applied biomaterials, 2009-11, Vol.91B (2), p.948-956
Main Authors: Belli, Sema, Özçopur, Betül, Yeşilyurt, Cemal, Bulut, Güneş, Ding, Xingzhe, Dorsman, Greg
Format: Article
Language:English
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Summary:This in vitro study analyzed the effect of mechanical loading on microtensile bond strength (μTBS) to dentin of four all‐in‐one adhesives and compared with a total‐etch adhesive system. The tested adhesives were Danville Experimental (an unfilled single‐component adhesive containing a proprietary organophosphate and hydrophobic monomers; Danville Materials), G Bond (GC), Clearfil S3 Bond (Kuraray), AdheSE One (Vivadent), and Prelude Total‐Etch (Danville Materials). Dentin surfaces were exposed and composite resin (AP‐X, Kuraray) build‐ups were created. The samples were divided into two subgroups and the first subgroups were subjected to mechanical fatigue loading (5 × 104; 50 Nat 0.2 Hz). Testing was performed after 1 week using a “nontrimming” μTBS test at a cross head speed of 1 mm/min. The data was calculated as MPa and statistically analyzed using Multivariate Analysis of Variance. Multiple comparisons were done using t‐test. Mechanical loading significantly decreased μTBS of the tested materials (p = 0.000). Prelude Total‐etch showed the highest bond strength values when compared to the tested all‐in‐one adhesives (p < 0.01). G Bond and Clearfil S3 Bond showed significantly higher bond strength values than Danville Experimental and AdheSE One (p < 0.01). © 2009 Wiley Periodicals, Inc. J Biomed Mater Res Part B: Appl Biomater, 2009
ISSN:1552-4973
1552-4981
DOI:10.1002/jbm.b.31480