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Copper Mediated and Copper Free “ C lick” Decoration of Polysialic Acid for RGD ‐ M odification and Hydrogel Formation

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Bibliographic Details
Published in:Macromolecular symposia. 2013-12, Vol.334 (1), p.82-91
Main Authors: Su, Yi, Paleček, Jiří, Kirschning, Andreas, Dräger, Gerald
Format: Article
Language:English
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ISSN:1022-1360
1521-3900
DOI:10.1002/masy.201300115