Optimum use of high-impedance surface in PCB to mitigate the simultaneous switching noise and radiated emission

Optimum use of high‐impedance surfaces (HIS) in high‐speed printed circuit boards (PCBs) of two layers to mitigate the simultaneous switching noise (SSN) and radiated emission is presented. The optimum condition is obtained with two rows of square pads between which is the power supply bus, creating...

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Bibliographic Details
Published in:Microwave and optical technology letters 2006-07, Vol.48 (7), p.1446-1449
Main Authors: Peña-Rivero, R., Jardón Aguilar, H., Linares y Miranda, R.
Format: Article
Language:English
Subjects:
high-impedance surface
high-speed digital signal
printed circuit board
radiated emission
simultaneous switching noise
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Summary:Optimum use of high‐impedance surfaces (HIS) in high‐speed printed circuit boards (PCBs) of two layers to mitigate the simultaneous switching noise (SSN) and radiated emission is presented. The optimum condition is obtained with two rows of square pads between which is the power supply bus, creating a rejection over the bandwidth frequency of interest. The effective method in two‐layer PCBs with two rows (3‐mm each) of square pads is implemented with a 0.5‐mm separation between the power‐supply bus, in the 8–12‐GHz frequency range, obtaining 20‐dB rejection and 15‐dB less radiated emission. © 2006 Wiley Periodicals, Inc. Microwave Opt Technol Lett 48: 1446–1449, 2006; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.21632
ISSN:0895-2477
1098-2760
DOI:10.1002/mop.21632