Dielectric analysis of the cure of thermosetting epoxy/amine systems

A low molecular weight epoxy resin is cured isothermally with an aromatic amine hardener, and the dielectric properties are measured as a function of the frequency, reaction time, and cure temperature. At specific stages in the cure, small samples from the reacting mixture are quenched and subsequen...

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Bibliographic Details
Published in:Polymer engineering and science 1989-03, Vol.29 (5), p.325-328
Main Authors: Bidstrup, Sue Ann, Sheppard Jr, Norman F., Senturia, Stephen D.
Format: Article
Language:English
Subjects:
Applied sciences
Exact sciences and technology
Industrial polymers. Preparations
Polymer industry, paints, wood
Technology of polymers
Thermosets
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Summary:A low molecular weight epoxy resin is cured isothermally with an aromatic amine hardener, and the dielectric properties are measured as a function of the frequency, reaction time, and cure temperature. At specific stages in the cure, small samples from the reacting mixture are quenched and subsequently analyzed for the glass transition temperature and epoxy group conversion by differential scanning calorimetry. In this manner, the change In dielectric properties can be directly correlated with the network structure. The ionic conductivity is modeled as a function of the cure temperature and the cure‐dependent glass transition temperature using a Williams‐Landel‐Ferry (WLF) relation. Combining this WLF relation with the DiBenedetto equation, a comprehensive model relating conductivity with the extent of reaction and cure temperature has been developed.
ISSN:0032-3888
1548-2634
DOI:10.1002/pen.760290510