Plasma deposition of a stable SiO x ‐like layer on copper surface for enhanced pool boiling heat transfer performance: A combination of microstructures and wetting properties

In this study, a thin film composed of inorganic SiO x  is deposited on the copper surface by atmospheric pressure plasma‐enhanced chemical vapor deposition. A pool boiling experiment is performed and the influence of the coating on pool boiling performance is examined. Morphology, composition, and...

Full description

Saved in:
Bibliographic Details
Published in:Plasma processes and polymers 2021-04, Vol.18 (4)
Main Authors: Mohammadi, Hamid R., Taghvaei, Hamed, Rabiee, Ataollah
Format: Article
Language:English
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:In this study, a thin film composed of inorganic SiO x  is deposited on the copper surface by atmospheric pressure plasma‐enhanced chemical vapor deposition. A pool boiling experiment is performed and the influence of the coating on pool boiling performance is examined. Morphology, composition, and wettability of the thin films are assessed using a scanning electron microscope, energy‐dispersive X‐ray spectrometer, and contact angle measurements. In addition to the enhancement of pool boiling thermal characteristics, especially a 103% increase in heat transfer coefficient, it is observed that the plasma‐deposited thin film on the copper surface is stable after the four boiling/cooling cycles. Finally, the underlying mechanism behind the improvements achieved by use of coated surface is studied.
ISSN:1612-8850
1612-8869
DOI:10.1002/ppap.202000209