75‐2: Failure Mechanisms and Optimum Methods for Through Glass Via

Due to high insulation, low dielectric loss and low cost, glass is considered as a promising substrate material for advanced package. Through glass via technology plays a key role in the 2.5D and 3D packaging. This paper analyzes failure mechanisms of TGV and discuss the optimum design and process.

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Bibliographic Details
Published in:SID International Symposium Digest of technical papers 2023-06, Vol.54 (1), p.1060-1063
Main Authors: An, Qichang, Xiao, Yuelei, Wei, Qiuxu, Wu, Yifan, Li, Huiying, Li, Yue
Format: Article
Language:English
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Description
Summary:Due to high insulation, low dielectric loss and low cost, glass is considered as a promising substrate material for advanced package. Through glass via technology plays a key role in the 2.5D and 3D packaging. This paper analyzes failure mechanisms of TGV and discuss the optimum design and process.
ISSN:0097-966X
2168-0159
DOI:10.1002/sdtp.16753