The effects of deposition temperature on the interfacial properties of SiH4 reduced blanket tungsten on TiN glue layer

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Bibliographic Details
Published in:Journal of electronic materials 1994-10, Vol.23 (10), p.1075-1080
Main Authors: LEE, Y. J, CHONG-OOK PARK, DONG-WON KIM, CHUN, J. S
Format: Article
Language:English
Subjects:
Applied sciences
Composition
defects and impurities
Condensed matter: structure, mechanical and thermal properties
Exact sciences and technology
Metals. Metallurgy
Physics
Solid surfaces and solid-solid interfaces
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
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ISSN:0361-5235
1543-186X
DOI:10.1007/bf02650379