Loading…

The effects of deposition temperature on the interfacial properties of SiH4 reduced blanket tungsten on TiN glue layer

Saved in:

Bibliographic Details
Published in:	Journal of electronic materials 1994-10, Vol.23 (10), p.1075-1080
Main Authors:	LEE, Y. J, CHONG-OOK PARK, DONG-WON KIM, CHUN, J. S
Format:	Article
Language:	English
Subjects:	Applied sciences Composition defects and impurities Condensed matter: structure, mechanical and thermal properties Exact sciences and technology Metals. Metallurgy Physics Solid surfaces and solid-solid interfaces Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties)
Citations:	Items that this one cites Items that cite this one
Online Access:	Get full text
Tags:	Add Tag No Tags, Be the first to tag this record!

cited_by	cdi_FETCH-LOGICAL-c324t-79f739e55b438c96b6228754ce5fa8dcc62fec596ace879ab47a65c3bb5a09a73
cites	cdi_FETCH-LOGICAL-c324t-79f739e55b438c96b6228754ce5fa8dcc62fec596ace879ab47a65c3bb5a09a73
container_end_page	1080
container_issue	10
container_start_page	1075
container_title	Journal of electronic materials
container_volume	23
creator	LEE, Y. J CHONG-OOK PARK DONG-WON KIM CHUN, J. S
description
doi_str_mv	10.1007/bf02650379
format	article
fullrecord	<record><control><sourceid>pascalfrancis_cross</sourceid><recordid>TN_cdi_crossref_primary_10_1007_BF02650379</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>3296326</sourcerecordid><originalsourceid>FETCH-LOGICAL-c324t-79f739e55b438c96b6228754ce5fa8dcc62fec596ace879ab47a65c3bb5a09a73</originalsourceid><addsrcrecordid>eNo9kE1LxDAQhoMouH5c_AU5eBKqSdMkzVEX1xUWPbiCtzJNJ2u025YkK-y_t-uqp-FlnmcYXkIuOLvmjOmb2rFcSSa0OSATLguR8VK9HZIJE4pnMhfymJzE-MEYl7zkE_K1fEeKzqFNkfaONjj00SffdzThesAAaROQ7uII-i5hcGA9tHQI_bhOHn-8Fz8vaMBmY7GhdQvdJyaaNt0qJux2-tI_0VW7QdrCFsMZOXLQRjz_nafkdXa_nM6zxfPD4_R2kVmRFynTxmlhUMq6EKU1qlZ5XmpZWJQOysZalY-fS6PAYqkN1IUGJa2oawnMgBan5Gp_14Y-xoCuGoJfQ9hWnFW7xqq72V9jI3y5hweIFloXoLM-_hsiN0rkSnwD9Clswg</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>The effects of deposition temperature on the interfacial properties of SiH4 reduced blanket tungsten on TiN glue layer</title><source>Springer LINK Archives</source><creator>LEE, Y. J ; CHONG-OOK PARK ; DONG-WON KIM ; CHUN, J. S</creator><creatorcontrib>LEE, Y. J ; CHONG-OOK PARK ; DONG-WON KIM ; CHUN, J. S</creatorcontrib><identifier>ISSN: 0361-5235</identifier><identifier>EISSN: 1543-186X</identifier><identifier>DOI: 10.1007/bf02650379</identifier><identifier>CODEN: JECMA5</identifier><language>eng</language><publisher>New York, NY: Institute of Electrical and Electronics Engineers</publisher><subject>Applied sciences ; Composition; defects and impurities ; Condensed matter: structure, mechanical and thermal properties ; Exact sciences and technology ; Metals. Metallurgy ; Physics ; Solid surfaces and solid-solid interfaces ; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><ispartof>Journal of electronic materials, 1994-10, Vol.23 (10), p.1075-1080</ispartof><rights>1995 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c324t-79f739e55b438c96b6228754ce5fa8dcc62fec596ace879ab47a65c3bb5a09a73</citedby><cites>FETCH-LOGICAL-c324t-79f739e55b438c96b6228754ce5fa8dcc62fec596ace879ab47a65c3bb5a09a73</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=3296326$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>LEE, Y. J</creatorcontrib><creatorcontrib>CHONG-OOK PARK</creatorcontrib><creatorcontrib>DONG-WON KIM</creatorcontrib><creatorcontrib>CHUN, J. S</creatorcontrib><title>The effects of deposition temperature on the interfacial properties of SiH4 reduced blanket tungsten on TiN glue layer</title><title>Journal of electronic materials</title><subject>Applied sciences</subject><subject>Composition; defects and impurities</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Exact sciences and technology</subject><subject>Metals. Metallurgy</subject><subject>Physics</subject><subject>Solid surfaces and solid-solid interfaces</subject><subject>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><issn>0361-5235</issn><issn>1543-186X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1994</creationdate><recordtype>article</recordtype><recordid>eNo9kE1LxDAQhoMouH5c_AU5eBKqSdMkzVEX1xUWPbiCtzJNJ2u025YkK-y_t-uqp-FlnmcYXkIuOLvmjOmb2rFcSSa0OSATLguR8VK9HZIJE4pnMhfymJzE-MEYl7zkE_K1fEeKzqFNkfaONjj00SffdzThesAAaROQ7uII-i5hcGA9tHQI_bhOHn-8Fz8vaMBmY7GhdQvdJyaaNt0qJux2-tI_0VW7QdrCFsMZOXLQRjz_nafkdXa_nM6zxfPD4_R2kVmRFynTxmlhUMq6EKU1qlZ5XmpZWJQOysZalY-fS6PAYqkN1IUGJa2oawnMgBan5Gp_14Y-xoCuGoJfQ9hWnFW7xqq72V9jI3y5hweIFloXoLM-_hsiN0rkSnwD9Clswg</recordid><startdate>19941001</startdate><enddate>19941001</enddate><creator>LEE, Y. J</creator><creator>CHONG-OOK PARK</creator><creator>DONG-WON KIM</creator><creator>CHUN, J. S</creator><general>Institute of Electrical and Electronics Engineers</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>19941001</creationdate><title>The effects of deposition temperature on the interfacial properties of SiH4 reduced blanket tungsten on TiN glue layer</title><author>LEE, Y. J ; CHONG-OOK PARK ; DONG-WON KIM ; CHUN, J. S</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c324t-79f739e55b438c96b6228754ce5fa8dcc62fec596ace879ab47a65c3bb5a09a73</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1994</creationdate><topic>Applied sciences</topic><topic>Composition; defects and impurities</topic><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Exact sciences and technology</topic><topic>Metals. Metallurgy</topic><topic>Physics</topic><topic>Solid surfaces and solid-solid interfaces</topic><topic>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>LEE, Y. J</creatorcontrib><creatorcontrib>CHONG-OOK PARK</creatorcontrib><creatorcontrib>DONG-WON KIM</creatorcontrib><creatorcontrib>CHUN, J. S</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><jtitle>Journal of electronic materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>LEE, Y. J</au><au>CHONG-OOK PARK</au><au>DONG-WON KIM</au><au>CHUN, J. S</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>The effects of deposition temperature on the interfacial properties of SiH4 reduced blanket tungsten on TiN glue layer</atitle><jtitle>Journal of electronic materials</jtitle><date>1994-10-01</date><risdate>1994</risdate><volume>23</volume><issue>10</issue><spage>1075</spage><epage>1080</epage><pages>1075-1080</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><coden>JECMA5</coden><cop>New York, NY</cop><pub>Institute of Electrical and Electronics Engineers</pub><doi>10.1007/bf02650379</doi><tpages>6</tpages></addata></record>
fulltext	fulltext
identifier	ISSN: 0361-5235
ispartof	Journal of electronic materials, 1994-10, Vol.23 (10), p.1075-1080
issn	0361-5235 1543-186X
language	eng
recordid	cdi_crossref_primary_10_1007_BF02650379
source	Springer LINK Archives
subjects	Applied sciences Composition defects and impurities Condensed matter: structure, mechanical and thermal properties Exact sciences and technology Metals. Metallurgy Physics Solid surfaces and solid-solid interfaces Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties)
title	The effects of deposition temperature on the interfacial properties of SiH4 reduced blanket tungsten on TiN glue layer
url	http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-06T09%3A34%3A50IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-pascalfrancis_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=The%20effects%20of%20deposition%20temperature%20on%20the%20interfacial%20properties%20of%20SiH4%20reduced%20blanket%20tungsten%20on%20TiN%20glue%20layer&rft.jtitle=Journal%20of%20electronic%20materials&rft.au=LEE,%20Y.%20J&rft.date=1994-10-01&rft.volume=23&rft.issue=10&rft.spage=1075&rft.epage=1080&rft.pages=1075-1080&rft.issn=0361-5235&rft.eissn=1543-186X&rft.coden=JECMA5&rft_id=info:doi/10.1007/bf02650379&rft_dat=%3Cpascalfrancis_cross%3E3296326%3C/pascalfrancis_cross%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c324t-79f739e55b438c96b6228754ce5fa8dcc62fec596ace879ab47a65c3bb5a09a73%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true