Heat dissipation from silicon chips in a vertical plate, elevated pressure cold wall system

Saved in:
Bibliographic Details
Published in:Journal of electronic materials 1982-03, Vol.11 (2), p.391-411
Main Authors: Reisman, A., Berkenblit, M., Merz, C. J., Ray, A. K.
Format: Article
Language:English
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:
ISSN:0361-5235
1543-186X
DOI:10.1007/BF02654679