Ductile regime grinding of silicon nitride ceramics based on dynamic critical grinding depth

• Published in: International journal of advanced manufacturing technology 2022-08, Vol.121 (9-10), p.6431-6438
• Main Authors: Liu, Wei, Tang, Dubo, Liu, Rentong, Deng, Zhaohui, Gu, Hao, Liu, Shun
• Format: Article
• Language: English
• Subjects: CAE) and Design; Computer-Aided Engineering (CAD; Engineering; Industrial and Production Engineering; Mechanical Engineering; Media Management; Original Article
• ISSN: 0268-3768; 1433-3015
• DOI: 10.1007/s00170-022-09741-9

Considering both the grinding parameters and dynamic mechanical properties of the silicon nitride ceramics, the dynamic critical grinding depth model of the ductile regime grinding was established. The grinding experiment of the silicon nitride ceramics was carried out on a surface grinder MGK7120 × 6/F. The grinding force was compared with the critical load for the cracking, then the material removal mode was analyzed. The pixel mesh method was used to calculate the proportion of the brittle regime, and the material removal mode was further validated. The material removal mode of the silicon nitride ceramic grinding was predicted using the maximum undeformed grinding thickness model and dynamic critical grinding depth model. The predicted results were consistent with the results of the experimental analysis, and the correctness of the dynamic critical grinding depth model of the ductile regime grinding was verified. The mechanism of the grinding strain rate on the material removal mode was analyzed, and it was found that increasing the strain rate was conducive to achieving the ductile material removal, then improving the grinding quality. The research is useful to optimize the grinding parameters to reduce the damage in the ceramic grinding.