Characterization of low pressure chemical vapor deposited polymeric fluorinated carbon m(C:FX)n thin films with low dielectric constant

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Published in:Applied physics. A, Materials science & processing Materials science & processing, 2006-04, Vol.83 (1), p.57-66
Main Authors: RASTOGI, A. C, DESU, S. B
Format: Article
Language:English
Subjects:
Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.)
Condensed matter: electronic structure, electrical, magnetic, and optical properties
Cross-disciplinary physics: materials science
rheology
Dielectric properties of solids and liquids
Dielectrics, piezoelectrics, and ferroelectrics and their properties
Exact sciences and technology
Materials science
Methods of deposition of films and coatings
film growth and epitaxy
Permittivity (dielectric function)
Physics
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ispartof Applied physics. A, Materials science & processing, 2006-04, Vol.83 (1), p.57-66
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subjects Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.)
Condensed matter: electronic structure, electrical, magnetic, and optical properties
Cross-disciplinary physics: materials science
rheology
Dielectric properties of solids and liquids
Dielectrics, piezoelectrics, and ferroelectrics and their properties
Exact sciences and technology
Materials science
Methods of deposition of films and coatings
film growth and epitaxy
Permittivity (dielectric function)
Physics
title Characterization of low pressure chemical vapor deposited polymeric fluorinated carbon m(C:FX)n thin films with low dielectric constant
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