High density and through wafer copper interconnections and solder bumps for MEMS wafer-level packaging

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Bibliographic Details
Published in:Microsystem technologies : sensors, actuators, systems integration actuators, systems integration, 2004-10, Vol.10 (6-7), p.517-521
Main Authors: LIN, C.-J, LIN, M.-T, WU, S.-P, TSENG, F.-G
Format: Article
Language:English
Subjects:
Applied sciences
Electronics
Exact sciences and technology
Instruments, apparatus, components and techniques common to several branches of physics and astronomy
Mechanical engineering. Machine design
Mechanical instruments, equipment and techniques
Microelectronic fabrication (materials and surfaces technology)
Micromechanical devices and systems
Physics
Precision engineering, watch making
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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ISSN:0946-7076
1432-1858
DOI:10.1007/s00542-004-0384-5