From MEMS devices to smart integrated systems

• Published in: Microsystem technologies 2008-07, Vol.14 (7), p.895-901
• Main Authors: Soeraasen, O., Ramstad, J. E.
• Format: Article
• Language: English
• Subjects: Applied sciences; Electronics; Electronics and Microelectronics; Engineering; Exact sciences and technology; Instrumentation; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Mechanical Engineering; Mechanical engineering. Machine design; Mechanical instruments, equipment and techniques; Microelectronic fabrication (materials and surfaces technology); Micromechanical devices and systems; Nanotechnology; Physics; Precision engineering, watch making; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Technical Paper
• ISSN: 0946-7076; 1432-1858
• DOI: 10.1007/s00542-007-0523-x

The smart integrated systems of tomorrow would demand a combination of micromechanical components and traditional electronics. On-chip solutions will be the ultimate goal. One way of making such systems is to implement the mechanical parts in an ordinary CMOS process. This procedure has been used to design an oscillator consisting of a resonating cantilever beam and a CMOS Pierce feedback amplifier. The resonating frequency is changed if the beam is bent by external forces. The paper describes central features of this procedure and highlights the design considerations for the CMOS-MEMS oscillator. The circuit is used as an example of a “VLSI designer” way of making future integrated micromechanical and microelectronic systems on-chip. The possibility for expansion to larger systems is reviewed.