Research on hot embossing process of high fill factor microlens array

In order to manufacture high fill factor microlens array in batches, this paper researches into gapless hexagonal microlens array manufactured through hot embossing, adopts FEM to calculate the stress of PMMA in hot embossing process of gapless hexagonal high fill factor microlens array, and analyze...

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Bibliographic Details
Published in:Microsystem technologies : sensors, actuators, systems integration actuators, systems integration, 2015-10, Vol.21 (10), p.2109-2114
Main Authors: Wang, Yiqing, Zhang, Qing, Kuang, Xinbin, Ding, Yucheng, Chen, Feng, Liu, Hongzhong
Format: Article
Language:English
Subjects:
Electronics and Microelectronics
Engineering
Instrumentation
Mechanical Engineering
Nanotechnology
Technical Paper
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Summary:In order to manufacture high fill factor microlens array in batches, this paper researches into gapless hexagonal microlens array manufactured through hot embossing, adopts FEM to calculate the stress of PMMA in hot embossing process of gapless hexagonal high fill factor microlens array, and analyzes the influencing factors of adhesion strength between the die and PMMA. The analysis result reveals that with the decrease of hot demolding temperature, the normal stress of PMMA drops gradually (the minimum stress exists) and that adhesion stress between the mold and PMMA will decline with the decrease of normal stress in PMMA, and that when demolding temperature drops to 20 °C, the height fidelity of microlens arrays reaches 94.7 %, which eliminates the defects in embossing and forming on a large scale.
ISSN:0946-7076
1432-1858
DOI:10.1007/s00542-014-2352-z