SAW based phononic crystal sensor, technological challenges and solutions

Phononic crystals (PnC) with a specifically designed liquid-filled defect have been recently introduced as a novel sensor platform (Lucklum et al. in Sens Actuators B Chem 171–172:271–277, 2012 ). Sensors based on this principle feature a band gap covering the typical input span of the measurand as...

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Bibliographic Details
Published in:Microsystem technologies : sensors, actuators, systems integration actuators, systems integration, 2016-07, Vol.22 (7), p.1593-1599
Main Authors: Schmidt, Marc-Peter, Oseev, Aleksandr, Lucklum, Ralf, Zubtsov, Mikhail, Hirsch, Soeren
Format: Article
Language:English
Subjects:
Electronics and Microelectronics
Engineering
Instrumentation
Mechanical Engineering
Nanotechnology
Technical Paper
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Summary:Phononic crystals (PnC) with a specifically designed liquid-filled defect have been recently introduced as a novel sensor platform (Lucklum et al. in Sens Actuators B Chem 171–172:271–277, 2012 ). Sensors based on this principle feature a band gap covering the typical input span of the measurand as well as a narrow transmission peak within the band gap where the frequency of maximum transmission is governed by the measurand. This approach has been applied for determination of volumetric properties of liquids (Lucklum et al. in Sens Actuators B Chem 171–172:271–277, 2012 ; Oseev et al. in Sens Actuators B Chem 189:208–212, 2013 ; Lucklum and Li in Meas Sci Technol 20(12):124014, 2009 ) and has demonstrated attractive sensitivity. One way to improve sensitivity requires higher probing frequencies in the range of 100 MHz and above. In this range surface acoustic wave (SAW) devices are an established basis for sensors. We have performed first tests towards a PnC microsensors (Lucklum et al. in Towards a SAW based phononic crystal sensor platform. In: 2013 Joint European frequency and time forum and international frequency control symposium (EFTF/IFC), pp 69–72, 2013 ). The respective feature size of the PnC SAW sensor has dimensions in the range of 10 µm and below. Whereas those dimensions are state of the art for common MEMS materials, etching of holes and cavities in piezoelectric materials that have an aspect ratio diameter/depth is still challenging. In this contribution we describe an improved technological process able to realize considerably deep and uniform holes in a SAW substrate.
ISSN:0946-7076
1432-1858
DOI:10.1007/s00542-015-2781-3