PMMA microfluidic chip fabrication using laser ablation and low temperature bonding with OCA film and LOCA

A new PMMA microfluidic chip fabrication method by combining laser ablation technology with low-temperature bonding using optically clear adhesive (OCA) film and liquid optically clear adhesive (LOCA) was presented in this paper. The deformation and clogging issues of the microfluidic channel were w...

Full description

Saved in:
Bibliographic Details
Published in:Microsystem technologies : sensors, actuators, systems integration actuators, systems integration, 2017-06, Vol.23 (6), p.1937-1942
Main Authors: Liu, Kan, Xiang, Jianzhen, Ai, Zhao, Zhang, Shoukun, Fang, Yi, Chen, Ting, Zhou, Qiongwei, Li, Songzhan, Wang, Shengxiang, Zhang, Nangang
Format: Article
Language:English
Subjects:
Electronics and Microelectronics
Engineering
Instrumentation
Mechanical Engineering
Nanotechnology
Technical Paper
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:A new PMMA microfluidic chip fabrication method by combining laser ablation technology with low-temperature bonding using optically clear adhesive (OCA) film and liquid optically clear adhesive (LOCA) was presented in this paper. The deformation and clogging issues of the microfluidic channel were well solved. The effective bonding area ratio of microfluidic chips could be greatly improved by adjusting bonding temperature and bonding time. The crevices around the microchannels were effectively eliminated by coating treatment of LOCA. The bonding strength and waterproof of PMMA microfluidic chips coating with/without LOCA were also evaluated in this paper.
ISSN:0946-7076
1432-1858
DOI:10.1007/s00542-016-2924-1