Shear test evaluation of the mechanical reliability of micro bumps in semiconductors

The micro bump is an element for connecting and stacking the silicon die of a semiconductor device, and any damage to the micro bump can greatly influence the reliability of the semiconductor. A shear test and analysis were performed to investigate the effect of the micro bump structure and shear sp...

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Bibliographic Details
Published in:Microsystem technologies : sensors, actuators, systems integration actuators, systems integration, 2022-10, Vol.28 (10), p.2173-2180
Main Authors: Cho, Yeungjung, Hahn, Mibbeum, Jeong, Hyunsik, Jang, Gunhee
Format: Article
Language:English
Subjects:
Electronics and Microelectronics
Engineering
Instrumentation
Mechanical Engineering
Nanotechnology
Technical Paper
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Summary:The micro bump is an element for connecting and stacking the silicon die of a semiconductor device, and any damage to the micro bump can greatly influence the reliability of the semiconductor. A shear test and analysis were performed to investigate the effect of the micro bump structure and shear speed on the failure mode, and a structural improvement was proposed. The failure mode and reaction force of the micro bump were measured through shear tests of four micro bump structures with a diameter of 25  μ m at two shear speeds using a bond tester. In addition, a finite element model simulating the shear test was developed using ANSYS and was analyzed under the same conditions as the shear test. It was confirmed that tungsten via has a resistance effect on shear force. Additionally, a structural improvement of the micro bump to resist shear force was suggested by analyzing the passivation thickness and bottom diameter of the micro bumps as design variables.
ISSN:0946-7076
1432-1858
DOI:10.1007/s00542-021-05245-w