Formation of Refined Grain Size Less Than 5 nm and Nano-sized Undulations in the Bonding Interface Region of an Ultrasonic Spot Welded Cu/Ni Joint

The microstructure in the bonding interface region of an ultrasonic spot welded Cu/Ni joint was investigated. At the copper side near the bonding interface, all the refined grains with random orientations and high-angle grain boundaries are

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Bibliographic Details
Published in:Metallurgical and materials transactions. A, Physical metallurgy and materials science Physical metallurgy and materials science, 2020-11, Vol.51 (11), p.5606-5611
Main Authors: Ni, Z. L., Yang, J. J., Wang, X. X., Huang, L., Ye, F. X.
Format: Article
Language:English
Subjects:
Characterization and Evaluation of Materials
Chemistry and Materials Science
Communication
Materials Science
Metallic Materials
Nanotechnology
Structural Materials
Surfaces and Interfaces
Thin Films
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Description
Summary:The microstructure in the bonding interface region of an ultrasonic spot welded Cu/Ni joint was investigated. At the copper side near the bonding interface, all the refined grains with random orientations and high-angle grain boundaries are
ISSN:1073-5623
1543-1940
DOI:10.1007/s11661-020-05956-1