Effects of Solvents in the Polyethylene Glycol Series on the Bonding of Copper Joints Using Ag2O Paste

• Published in: Journal of electronic materials 2013-03, Vol.42 (3), p.507-515
• Main Authors: Takata, Shinya, Ogura, Tomo, Ide, Eiichi, Morita, Toshiaki, Hirose, Akio
• Format: Article
• Language: English
• Subjects: Applied sciences; Brazing. Soldering; Characterization and Evaluation of Materials; Chemistry and Materials Science; Electronics; Electronics and Microelectronics; Exact sciences and technology; Instrumentation; Joining, thermal cutting: metallurgical aspects; Materials; Materials Science; Metals. Metallurgy; Optical and Electronic Materials; Solid State Physics
• ISSN: 0361-5235; 1543-186X
• DOI: 10.1007/s11664-012-2354-5

The effects of reducing solvents on the bonding process using silver oxide paste in a copper joint were investigated. Three solvent types were tested: diethylene glycol (DEG), triethylene glycol (TEG), and polyethylene glycol (PEG). The strength of the joints was assessed by fracturing, which occurred at the interface of the copper oxide layer and the copper substrate in DEG and TEG samples and at the bonded interface in the PEG sample. Analysis of the samples revealed that, in the DEG and TEG samples, the copper substrate was oxidized during the bonding process, which compromised the shear strength of the joints. In contrast, the PEG sample exhibited nonuniform sintering of the silver layer while retaining good shear strength. It was found that the combination of DEG and PEG produced optimum shear strength in the copper joint, as PEG suppressed the growth of copper oxide and DEG promoted the formation of a dense sintered silver layer. The bonding strength achieved was higher than that of the gold-to-gold joint made using standard Pb-5Sn solder.