Microstructural Evolution and Mechanical Properties in (AuSn)eut-Cu Interconnections

• Published in: Journal of electronic materials 2016-10, Vol.45 (10), p.5478-5486
• Main Authors: Dong, Hongqun, Vuorinen, Vesa, Laurila, Tomi, Paulasto-Kröckel, Mervi
• Format: Article
• Language: English
• Subjects: Characterization and Evaluation of Materials; Chemistry and Materials Science; Electronics and Microelectronics; Instrumentation; Materials Science; Optical and Electronic Materials; Solid State Physics
• ISSN: 0361-5235; 1543-186X
• DOI: 10.1007/s11664-016-4733-9

The interfacial reactions between the widely employed solder Au-20wt.%Sn and the common contact metallizations (e.g. Ni, Cu and Pt) are normally complex and not well determined. In order to identify the proper contactor for Au-20wt.%Sn solder, the present study focuses on (1) rationalizing the interfacial reaction mechanisms of Au-20wt.%Sn|Cu as well as (2) measuring the mechanical properties of individual intermetallics formed at the interface. The evolution of interfacial reaction products were rationalized by using the experimental results in combination with the calculated Au-Cu-Sn phase diagram information. It was found that the growth of the AuCu interfacial intermetallic layer was diffusion-controlled. The diffusion path of Au-20wt.%Sn|Cu at 150°C was proposed. The hardness and indentation modulus of the interfacial reaction products were measured using nanoindentation tests. The results revealed a significant influence of the Cu solubility on the mechanical properties of (Au,Cu)Sn and (Au,Cu) 5 Sn, i.e. their hardness and contact modulus increased with the increase in the amount of Cu. Furthermore, results obtained here for the Au-20wt.%Sn|Cu joints were compared to those from Au-20wt.%Sn|Ni in order to assess the similarities and differences between these widely used interconnection metallization systems.