Microstructure and Properties of Nanocrystalline Copper Strengthened by a Low Amount of Al2O3 Nanoparticles

• Published in: Journal of materials engineering and performance 2017-03, Vol.26 (3), p.1057-1061
• Main Authors: Ďurišinová, Katarína, Ďurišin, Juraj, Ďurišin, Martin
• Format: Article
• Language: English
• Subjects: Characterization and Evaluation of Materials; Chemistry and Materials Science; Corrosion and Coatings; Engineering Design; Materials Science; Quality Control; Reliability; Safety and Risk; Tribology
• ISSN: 1059-9495; 1544-1024
• DOI: 10.1007/s11665-017-2534-9

Dispersion-strengthened Cu-Al 2 O 3 materials have been studied over recent years to find an optimum processing route to obtain a high strength, thermal-stable copper alloy designed for modern applications in electrical engineering. The study analyses the influence of 1 vol.% of alumina content on strengthening the copper matrix. Microstructure of the Cu-Al 2 O 3 composite was studied by x-ray diffraction as well as scanning and transmission electron microscopy. The composite shows a homogeneous, thermal-stable nanostructure up to 900 °C due to dispersed alumina nanoparticles. The particles effectively strengthen crystallite/grain boundaries in processes of powder consolidation and annealing of the compact. In contrast to monolithic Cu, the Cu-1 vol.% Al 2 O 3 exhibits more than double strength and hardness. The nanocrystalline matrix and the low amount of alumina particles result in a yield strength of 288 MPa and a ductility of 15% which is a good combination for practical utilization of the material.