Study on Stress and Plastic Deformation of Scaled Cylinder Head Specimens under Thermal Shock

Thermal fatigue properties of several scaled cylinder head specimens (SCHS) are evaluated. The plastic deformation of the intake holes (ITH) and exhaust holes (EXH) during the experiment was recorded. The results show that the plastic deformation mainly occurred in the early stage of the thermal sho...

Full description

Saved in:
Bibliographic Details
Published in:Journal of materials engineering and performance 2023-10, Vol.32 (20), p.9051-9063
Main Authors: Xie, Guangyi, Lei, Jilin, Deng, Xiwen, Deng, Wei, Jia, Dewen, Song, Peng, Huang, Taihong, Zhang, Huabing
Format: Article
Language:English
Subjects:
Characterization and Evaluation of Materials
Chemistry and Materials Science
Corrosion and Coatings
Engineering Design
Materials Science
Quality Control
Reliability
Safety and Risk
Technical Article
Tribology
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Thermal fatigue properties of several scaled cylinder head specimens (SCHS) are evaluated. The plastic deformation of the intake holes (ITH) and exhaust holes (EXH) during the experiment was recorded. The results show that the plastic deformation mainly occurred in the early stage of the thermal shock. The increment of the plastic deformation decreases with an increase in the number of fatigue test cycles. Additionally, the thermal stress distribution indicates that the nose bridges of the SCHS suffers greater thermal stresses than other areas. In particular, nose bridges between the ITH and EXH suffer the largest thermal stress than the other nose bridges. Furthermore, nose bridges with lower thermal stress, reduced initial surface roughness and deformation have better performance in terms of thermal fatigue life. This study provides a basis for exploring the thermal fatigue failure mechanism of cylinder head and is beneficial for the cylinder head design.
ISSN:1059-9495
1544-1024
DOI:10.1007/s11665-023-07954-x