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Optimum conditions for pure culture of major ectomycorrhizal fungi obtained from Pinus sylvestris var. mongolica plantations in southeastern Keerqin sandy lands, China
The effects of medium, pH, water potential and temperature on the culture for three pure strains (Lactarius deliciosus, Boletus edulis and Lactarius insulsus) of ectomycorrhizal fungi from plantation forests of Mongolian pine (Pinus sylvestris var. mongolica) on sandy lands were observed to obtain t...
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Published in: | Journal of forestry research 2008, Vol.19 (2), p.113-118 |
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Main Authors: | , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | The effects of medium, pH, water potential and temperature on the culture for three pure strains (Lactarius deliciosus, Boletus edulis and Lactarius insulsus) of ectomycorrhizal fungi from plantation forests of Mongolian pine (Pinus sylvestris var. mongolica) on sandy lands were observed to obtain the optimum conditions for the growth of ectomycorrhizal fungi. The results indicated that the three ectomycorrhizal fungi could grow well in the mediums containing natural components, such as vitamin, pine juice and yeast powder, pH had a slight effect on the growth of the three ectomycorrhizal fungi, and the optimum pH values were 6.0 for L. deliciosus, 5.0 for B. edulis, respectively. However, L. insulsus had a wide pH range, and it grew better than the other two strains in neutral and light alkalescent mediums. Water potential (produced by Polyethylene Glycol, PEG) had significant effects on the ecological adaptability for the tested three fungi strains. All of the three stains grow better at lower PEG concentration (100 g PEG.kg^-1 H2O). The best water potential was 10% PEG concentration for all of the three stains. Temperatures, especially high temperatures induced the fungi death. The optimum temperature for the growth of ectomycorrhizal fungi was 25-28℃ for all of the three stains. |
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ISSN: | 1007-662X 1993-0607 |
DOI: | 10.1007/s11676-008-0019-2 |