Ti substituted nano-crystalline Cu3N thin films

• Published in: Journal of Coatings Technology and Research 2011-03, Vol.8 (2), p.289-297
• Main Authors: Rahmati, A., Bidadi, H., Ahmadi, K., Hadian, F.
• Format: Article
• Language: English
• Subjects: Chemistry and Materials Science; Corrosion and Coatings; Cross-disciplinary physics: materials science; rheology; Deposition by sputtering; Exact sciences and technology; Industrial Chemistry/Chemical Engineering; Materials Science; Methods of deposition of films and coatings; film growth and epitaxy; Physics; Polymer Sciences; Surfaces and Interfaces; Thin Films; Tribology
• ISSN: 1547-0091; 1945-9645; 1935-3804
• DOI: 10.1007/s11998-010-9279-9

Ti:Cu 3 N thin films were deposited on Si(111), quartz, and glass slide substrates by DC magnetron sputtering in molecular nitrogen ambient. The structural properties of Ti:Cu 3 N thin films were studied by X-ray diffraction (XRD) analysis. XRD measurements show diffraction band with peaks close to the (100) and (200) diffraction lines of cubic anti-ReO 3 structure of Cu 3 N. The Ti:Cu 3 N nano-crystalline size is in the range 22–27 nm. Lattice constant expansion reflects Ti incorporation causing the excess nitrogen to occur. Surface morphology shows that the N richness suppresses the grain growth. The optical absorption spectra indicate a remarkable shift to higher energies of the absorption edge due to higher N concentration and quantum size effect. Photoluminescence (PL) measurement shows interstitial N excess and Ti impurity produce shallow and deep levels, respectively. Thermal stability of the Ti:Cu 3 N films annealed at 300 and 400°C is improved in comparison with that of Ti free Cu 3 N films.