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Effects of colloidal silica on the properties of POSS-containing fluorinated poly(styrene–acrylate)/SiO2 composite materials
Polyhedral oligomeric silsesquioxane (POSS)-containing fluorinated poly(styrene–acrylate)/SiO 2 (POSS-FPSA/SiO 2 ) composite materials were prepared by preemulsification and direct blending method. The SiO 2 particles were induced aggregated onto the surface of POSS, and sol–gel processes were simul...
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Published in: | JCT research 2021, Vol.18 (1), p.107-116 |
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Main Authors: | , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Polyhedral oligomeric silsesquioxane (POSS)-containing fluorinated poly(styrene–acrylate)/SiO
2
(POSS-FPSA/SiO
2
) composite materials were prepared by preemulsification and direct blending method. The SiO
2
particles were induced aggregated onto the surface of POSS, and sol–gel processes were simultaneously carried out with addition of co-solvent to form raspberry-like structure.
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Si NMR and XRD results confirmed that POSS were successfully grafted to polymer and were evenly dispersed uniformly in polymer matrix. The average diameter of composite latexes increased from 63 to 81 nm with increasing addition of SiO
2
content. AFM and WCA images confirmed that sol–gel processes were promoted by increasing addition of SiO
2
content, which improved the roughness and hydrophobicity of composite films. XPS spectra displayed that two kinds of Si–O bonds existed on the surface of composite films. One was related to the Si–O groups of SiO
2
, and the other was attributed to the Si–O–Si groups obtained from the sol–gel processes. The peak area of the former decreased from 56.86% to 38.78%, while the latter increased from 43.14% to 62.22%. TGA curves demonstrated that the composite film exhibited better thermal stability when the SiO
2
content was 10.0%. In addition, serious phase separation would decrease the thermal stability of composite films. |
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ISSN: | 1547-0091 1935-3804 2168-8028 |
DOI: | 10.1007/s11998-020-00384-7 |