Using statistical models for optimal packaging in semiconductor manufacturing processes

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Bibliographic Details
Published in:Journal of the Korean Statistical Society 2024-08
Main Authors: Kim, Dongguen, Kim, Heejin, Kim, Yejin, Chae, Minwoo, Ko, Young Myoung, Bae, Young-Mok, Sim, Hyungsub, Oh, Young Chan, Noh, Keum Hwan
Format: Article
Language:English
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ISSN:1226-3192
2005-2863
DOI:10.1007/s42952-024-00284-1