Noise analysis in metal deposition—expectations and limits

The application of electrochemical noise analysis (ENA) on the electrocrystallization processes of metals is discussed on the basis of the well-known nucleation and growth mechanisms studied experimentally by transient techniques of silver deposition on quasi-perfect silver single crystal faces. Sim...

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Bibliographic Details
Published in:Electrochimica acta 1989-08, Vol.34 (8), p.1023-1029
Main Authors: Budevski, E., Obretenov, W., Bostanov, W., Staikov, G., Doneit, J., Jüttner, K., Lorenz, W.J.
Format: Article
Language:English
Subjects:
Chemistry
Electrochemistry
Electrodeposition
Exact sciences and technology
General and physical chemistry
Study of interfaces
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Summary:The application of electrochemical noise analysis (ENA) on the electrocrystallization processes of metals is discussed on the basis of the well-known nucleation and growth mechanisms studied experimentally by transient techniques of silver deposition on quasi-perfect silver single crystal faces. Simulations of simplified 2-D nucleation and mononuclear growth mechanisms show that the nucleation and propagation rates are reflected in the power spectrum and the autocorrelation function. The analysis of data becomes difficult if both the nucleation and propagation rates are Poissonian distributed. First experimental results obtained for the silver deposition on quasi-perfect silver single crystal faces and the copper deposition on polycrystalline microelectrodes are reported.
ISSN:0013-4686
1873-3859
DOI:10.1016/0013-4686(89)87135-X