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The low thermal stress HP-LEC growth of 75 mm diameter In-DOPED GaAs crystals

A study is presented of the effects of various thermal environments in a Melbourn high-pressure liquid encapsulated Czochralski puller on the thermal stress experienced by 75 mm diameter GaAs crystals doped with between 5.4×10 19 to 2.1×10 20cm −3 indium. Approaches investigated for obtaining low th...

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Bibliographic Details
Published in:Journal of crystal growth 1989, Vol.94 (1), p.75-84
Main Authors: McGuigan, S., Swanson, B.W., Thomas, R.N.
Format: Article
Language:English
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Summary:A study is presented of the effects of various thermal environments in a Melbourn high-pressure liquid encapsulated Czochralski puller on the thermal stress experienced by 75 mm diameter GaAs crystals doped with between 5.4×10 19 to 2.1×10 20cm −3 indium. Approaches investigated for obtaining low thermal stress growth conditions include the use of thick (up to 6 cm) B 2O 3 encapsulating layers, a graphite “top hat” enclosure, and a controllable crystal after-heater and encapsulant heat shield. Of these, the latter configuration appears to yield the lowest thermal stress growth conditions using a 2 cm thick B 2O 3 encapsulant layer. Growths performed using this configuration have yielded low-dislocation (
ISSN:0022-0248
1873-5002
DOI:10.1016/0022-0248(89)90605-2