The chemistry of the additives in an acid copper electroplating bath

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Bibliographic Details
Published in:Journal of electroanalytical chemistry (Lausanne, Switzerland) Switzerland), 1992-10, Vol.338 (1-2), p.167-177
Main Authors: Healy, John P., Pletcher, Derek, Goodenough, Mark
Format: Article
Language:eng ; jpn
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ISSN:1572-6657
DOI:10.1016/0022-0728(92)80421-Y