The adhesion of low pressure chemically vapour deposited tungsten films on silicon and SiO2 for SiH4-H2-WF6 and H2-WF6 processes

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Bibliographic Details
Published in:Thin solid films 1991-06, Vol.201 (1), p.167-174
Main Authors: PARK, Y. W, PARK, C. O, CHUN, J. S
Format: Article
Language:English
Subjects:
Applied sciences
Condensed matter: structure, mechanical and thermal properties
Exact sciences and technology
Metals. Metallurgy
Physical properties of thin films, nonelectronic
Physics
Solid surfaces and solid-solid interfaces
Surface energy
thermodynamic properties
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
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ISSN:0040-6090
1879-2731
DOI:10.1016/0040-6090(91)90164-S