Silicon multichip modules: evolving a high performance technology from low-end applications

Recently, silicon-on-silicon multichip modules (MCMs) have shifted away from high performance digital applications toward low-end, cost driven products with a primary emphasis on volume production. This shift has been accompanied by changes in the physical structure of the MCM interconnections. Cost...

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Bibliographic Details
Published in:Materials Chemistry and Physics 1995-05, Vol.40 (4), p.230-235
Main Authors: Frye, Robert C., Tai, King L.
Format: Article
Language:English
Subjects:
Applied sciences
Electronics
Exact sciences and technology
Microelectronic fabrication (materials and surfaces technology)
Multichip modules
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Silicon multichip modules
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Summary:Recently, silicon-on-silicon multichip modules (MCMs) have shifted away from high performance digital applications toward low-end, cost driven products with a primary emphasis on volume production. This shift has been accompanied by changes in the physical structure of the MCM interconnections. Cost reduction has driven them toward thinner metal and dielectric layers, and wherever possible toward the use of fewer layers. It has also fundamentally changed the flip-chip attachment process. We are now reexamining the effect these changes are having on the performance characteristics of the technology, and the role of MCMs in systems packaging.
ISSN:0254-0584
1879-3312
DOI:10.1016/0254-0584(95)01486-1