Electrodeposition on wire in a scalled-up overflow cell

The effect of potential sweep rate, fluid flow rate, Q, and concentration of CuSO 4 solutions with large excess of H 2SO 4 was studied during copper electrodeposition on 0.51 mm diameter, stationary, horizontal, copper wire. The mass transfer rate was found within the investigated range to be propor...

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Bibliographic Details
Published in:Electrodeposition and surface treatment 1974, Vol.2 (6), p.481-492
Main Author: Tvarusko, A.
Format: Article
Language:English
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Summary:The effect of potential sweep rate, fluid flow rate, Q, and concentration of CuSO 4 solutions with large excess of H 2SO 4 was studied during copper electrodeposition on 0.51 mm diameter, stationary, horizontal, copper wire. The mass transfer rate was found within the investigated range to be proportional to Q 0.40 and independent of cell size, material, diameter and resistance of wire, composition and concentration of the solution, and sweep rate. The limiting current density increased with Cu ++ concentration but at a lower than theoretical rate. The results are applicable to wire moving slowly (< 0.1 m/sec) in longer overflow cells in the presence of forced fluid flow.
ISSN:0300-9416
DOI:10.1016/0300-9416(74)90027-3