The electrodeposition of metal at metal/carbon nanotube junctions

• Published in: Chemical physics letters 2002-08, Vol.361 (5), p.525-529
• Main Authors: Austin, Derek W., Puretzky, Alex A., Geohegan, David B., Britt, Phillip F., Guillorn, Michael A., Simpson, Michael L.
• Format: Article
• Language: English
• Subjects: Condensed matter: electronic structure, electrical, magnetic, and optical properties; Cross-disciplinary physics: materials science; rheology; Electronic structure and electrical properties of surfaces, interfaces, thin films and low-dimensional structures; Electronic transport in interface structures; Exact sciences and technology; Materials science; Metal-nonmetal contacts; Nanoscale materials and structures: fabrication and characterization; Physics
• ISSN: 0009-2614; 1873-4448
• DOI: 10.1016/S0009-2614(02)00992-2

We deposited a semiconducting single-walled carbon nanotube on Pd electrodes, and the initial charge transport measurements showed the usual large contact resistance between the electrodes and the nanotube. We electroplated Au over the electrodes with no obvious deposition of Au along the sidewalls of the nanotube between the electrodes. Post deposition charge transport measurements indicated more than a factor of six decrease in the electrode/nanotube contact resistance, yet the semiconducting behavior of the nanotube was maintained. A significant difference in the post deposition I– V characteristics may be explained by an electronic or mechanical modification of the nanotube/electrode junction.