Comparison of surface polishing techniques used for InP wafers

InP wafers prepared using different polishing and mounting methods were compared by Makyoh topography, which is capable of detecting extremely small surface height variations. In some wafers a cellular surface ridge structure due to uneven mounting wax distribution was observed. It is shown that the...

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Bibliographic Details
Published in:Journal of crystal growth 1995, Vol.153 (1), p.1-5
Main Authors: Laczik, Z., Booker, G.R., Mowbray, A.
Format: Article
Language:English
Subjects:
Condensed matter: structure, mechanical and thermal properties
Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
Materials science
Physics
Solid surfaces and solid-solid interfaces
Surface structure and topography
Surface treatments
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
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Summary:InP wafers prepared using different polishing and mounting methods were compared by Makyoh topography, which is capable of detecting extremely small surface height variations. In some wafers a cellular surface ridge structure due to uneven mounting wax distribution was observed. It is shown that the ridge structure can be completely eliminated by the optimisation of the wafer mounting procedure or by the use of a “free floating” double sided polishing technique.
ISSN:0022-0248
1873-5002
DOI:10.1016/S0022-0248(08)80140-6