Simulation of failure time distributions of metal lines under electromigration

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Bibliographic Details
Published in:Microelectronics and reliability 2002-09, Vol.42 (9), p.1469-1472
Main Authors: Carriero, M.R., Di Pascoli, S., Iannaccone, G.
Format: Article
Language:English
Online Access:Get full text
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ISSN:0026-2714
1872-941X
DOI:10.1016/S0026-2714(02)00172-5