Reliability aspects of semiconductor devices in high temperature applications

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Bibliographic Details
Published in:Microelectronics and reliability 2003-09, Vol.43 (9), p.1839-1846
Main Authors: Kanert, W., Dettmer, H., Plikat, B., Seliger, N.
Format: Article
Language:English
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ISSN:0026-2714
1872-941X
DOI:10.1016/S0026-2714(03)00313-5