New X-ray diffraction method for materials science

• Published in: Thin solid films 1998-04, Vol.319 (1), p.16-19
• Main Authors: Swiatek, Z, Bonarski, J.T, Ciach, R, Kuznicki, Z.T
• Format: Article
• Language: English
• Subjects: Back-reflection technique; Condensed matter: structure, mechanical and thermal properties; Exact sciences and technology; Materials science; Mechanical and acoustical properties; Physical properties of thin films, nonelectronic; Physics; Single-crystal and powder diffraction; Structure and morphology; thickness; Structure of solids and liquids; crystallography; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties); Thin film structure and morphology; X-ray diffraction; X-ray diffraction and scattering
• ISSN: 0040-6090; 1879-2731
• DOI: 10.1016/S0040-6090(97)01101-2

A new and very promising X-ray diffraction method for the texture and internal stress investigation is described. This method, based on the conventional pole figure measurements in the back-reflection technique, affords possibilities for investigations of the diffraction effects due to layers on a given depth in a material. The condition of constant information depth is attained by abandoning the Bragg–Brentano localization geometry, using an appropriate offset angle for each sample tilt angle. During such measurement, after selection of the adequate offset angle, its corresponding change proceeds automatically. In order to obtain satisfactory integrated intensities, a pseudo-position sensitive detection technique is applied. The proposed method in this non-symmetrical mode is both a recommendable and useful tool for studying textured and epitaxial thin films as well as multi-layer systems.