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Structure and electrical properties of boron-added (Ba,Sr)TiO3 thin films fabricated by the sol-gel method
Thin films of BaxSr1−xTiO3 (BST, with x=0.5) were fabricated on a RuO2/Ru/SiO2/Si substrate by the spin coating of the multicomponent sol prepared using metal alkoxides. Boron alkoxide was intentionally introduced to establish a better microstructure and to reduce the leakage current. AFM indicated...
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Published in: | Thin solid films 1998-09, Vol.330 (2), p.89-95 |
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Main Authors: | , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Thin films of BaxSr1−xTiO3 (BST, with x=0.5) were fabricated on a RuO2/Ru/SiO2/Si substrate by the spin coating of the multicomponent sol prepared using metal alkoxides. Boron alkoxide was intentionally introduced to establish a better microstructure and to reduce the leakage current. AFM indicated that a crack-free uniform microstructure having a smooth surface was gradually developed with increasing boron content. The relative dielectric permittivity of the 250-nm thick BST thin films fired at 700°C decreased with increasing content of boron, from 420 for the undoped film to 190 for the 10 mol% boron-added film at 1 MHz. This observation was interpreted in terms of a serial capacitance composed of the perovskite BST grain and the interfacial B2O3 glassy phase having a low dielectric permittivity. The leakage current density (J) also decreased with the amount of boron added. The leakage current for the applied voltage greater than 1 V showed a linear variation of logJ with E1/2 at room temperature, suggesting that the interface-controlled Schottky emission was the dominant conduction process for the BST thin films fabricated on the RuO2 electrode. |
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ISSN: | 0040-6090 1879-2731 |
DOI: | 10.1016/S0040-6090(98)00560-4 |