Vertical differential displacements at a pad/sapphire interface during polishing

This paper describes the results of measurements of the vertical displacement between a polishing pad and a sapphire disk surface. Those experiments were intended to simulate silicon/pad interaction as it occurs in the chemical-mechanical polishing of integrated circuits. Results show that the pad i...

Full description

Saved in:
Bibliographic Details
Published in:Wear 1997-11, Vol.211 (2), p.311-315
Main Authors: Mess, F., Levert, J., Danyluk, S.
Format: Article
Language:English
Subjects:
Applied sciences
Capillarity
Chemical-mechanical polishing
Electronics
Exact sciences and technology
Fluid film thickness measurements
Friction, wear, lubrication
Machine components
Mechanical engineering. Machine design
Microelectronic fabrication (materials and surfaces technology)
Polishing
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Silicon
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:This paper describes the results of measurements of the vertical displacement between a polishing pad and a sapphire disk surface. Those experiments were intended to simulate silicon/pad interaction as it occurs in the chemical-mechanical polishing of integrated circuits. Results show that the pad is suctioned into the sapphire surface so that the measured displacement is negative by up to 7 μm. Capillarity associated with the surface roughness of the pad is able to account for approximately 4 μm of this negative displacement.
ISSN:0043-1648
1873-2577
DOI:10.1016/S0043-1648(97)00113-0