Three dimensional metallization for vertically integrated circuits

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Bibliographic Details
Published in:Microelectronic engineering 1997-11, Vol.37-38, p.39-47
Main Authors: Ramm, P., Bollmann, D., Braun, R., Buchner, R., Cao-Minh, U., Engelhardt, M., Errmann, G., Graßl, T., Hieber, K., Hübner, H., Kawala, G., Kleiner, M., Klumpp, A., Kühn, S., Landesberger, C., Lezec, H., Muth, W., Pamler, W., Popp, R., Renner, E., Ruhl, G., Sänger, A., Scheler, U., Schertel, A., Schmidt, C., Schwarzl, S., Weber, J., Weber, W.
Format: Article
Language:English
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ISSN:0167-9317
DOI:10.1016/S0167-9317(97)00092-0