Structure refinement and hardness enhancement of titanium nitride films by addition of copper

Titanium nitride films with a low added copper content were synthesized by ion beam-assisted sputtering deposition. The role of copper was examined with regard to the structure, hardness and elastic/plastic deformation capacity of the composite films produced. It was found that copper had significan...

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Bibliographic Details
Published in:Surface & coatings technology 2001, Vol.137 (1), p.38-42
Main Authors: He, J.L., Setsuhara, Y., Shimizu, I., Miyake, S.
Format: Article
Language:English
Subjects:
Condensed matter: structure, mechanical and thermal properties
Copper
Exact sciences and technology
Ion beam deposition
Mechanical and acoustical properties
Nanoindentation
Physical properties of thin films, nonelectronic
Physics
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
Titanium nitride
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Summary:Titanium nitride films with a low added copper content were synthesized by ion beam-assisted sputtering deposition. The role of copper was examined with regard to the structure, hardness and elastic/plastic deformation capacity of the composite films produced. It was found that copper had significant modifying effects on the structure and property of titanium nitride films. When a very low content of Cu (2 at.% copper were comparatively soft, up to 53% of the deformation under indentation could be plastic in this case. In addition, copper additions could also be used to tune the grain size of TiN in the range of 25–5 nm, at the same time causing a transition from a strong (111) preferred orientation to random polycrystalline morphology.
ISSN:0257-8972
1879-3347
DOI:10.1016/S0257-8972(00)01089-6