Strength of bonding interface in lead-free Sn alloy solders

The effect of applying ultrasonic wave to soldering on the strength of the bonding interface in lead-free Sn–3.5%Ag, Sn–57%Bi and Sn–57%Bi–1%Ag solder joints has been investigated at various test temperatures and strain rates. The bonding strength of the solder joints depends on the test temperature...

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Bibliographic Details
Published in:Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 2001, Vol.319, p.475-479
Main Authors: Kikuchi, S, Nishimura, M, Suetsugu, K, Ikari, T, Matsushige, K
Format: Article
Language:English
Subjects:
Applied sciences
bonding strength
Brazing. Soldering
Exact sciences and technology
Joining, thermal cutting: metallurgical aspects
lead-free solders
Metals. Metallurgy
Sn alloys
structure of bonding interface
ultrasonic bonding
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Summary:The effect of applying ultrasonic wave to soldering on the strength of the bonding interface in lead-free Sn–3.5%Ag, Sn–57%Bi and Sn–57%Bi–1%Ag solder joints has been investigated at various test temperatures and strain rates. The bonding strength of the solder joints depends on the test temperature and the strain rate. The bonding strength of the Sn–Bi solder joints near room temperature is much higher than that of the Sn–3.5Ag solder, but the ductility is lower. The relation between the maximum stress in the stress–strain curve and the strain rate is indicated by the same power law type equation as high temperature creep. Applying ultrasonic wave to soldering influences the microstructure near the bonding interface. As a result, the fine microstructure layer is formed near the interface between the solder and the copper and it increases the strength of the bonding interface in the solder joints.
ISSN:0921-5093
1873-4936
DOI:10.1016/S0921-5093(01)01031-0