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Fabrication technology for miniaturization of the spin-valve transistor

A new fabrication technology that allows miniaturization of the spin-valve transistor is presented. The spin-valve transistor consists of a spin-valve base (Pt 2 nm/NiFe 3 nm/Au 3.5 nm/Co 3 nm/Au 4 nm) sandwiched between a Si emitter and collector. With the use of a silicon-on-insulator wafer and va...

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Bibliographic Details
Published in:Sensors and actuators. A, Physical Physical, 2001-06, Vol.91 (1), p.166-168
Main Authors: Kim, S.D, van’t Erve, O.M.J, Jansen, R, Anil Kumar, P.S, Vlutters, R, Lodder, J.C
Format: Article
Language:English
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Summary:A new fabrication technology that allows miniaturization of the spin-valve transistor is presented. The spin-valve transistor consists of a spin-valve base (Pt 2 nm/NiFe 3 nm/Au 3.5 nm/Co 3 nm/Au 4 nm) sandwiched between a Si emitter and collector. With the use of a silicon-on-insulator wafer and vacuum metal bonding, spin-valve transistors down to a few tens of micron size are realized through conventional photolithography and etching processes. These spin-valve transistors show 275% magnetocurrent at 87 K and 170% at room temperature in small magnetic fields.
ISSN:0924-4247
1873-3069
DOI:10.1016/S0924-4247(01)00518-0