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Characteristics of low force contact process for MEMS probe cards

Using an atomic force microscope (AFM) system and micromachined cantilever probes, we have investigated the relationship between contact forces and the fritting which should be utilized for making contact to IC pads in MEMS probe cards. As a result, it has been clarified that a stable low-resistance...

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Bibliographic Details
Published in:Sensors and actuators. A, Physical Physical, 2002-04, Vol.97, p.462-467
Main Authors: Itoh, Toshihiro, Kataoka, Kenichi, Suga, Tadatomo
Format: Article
Language:English
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Summary:Using an atomic force microscope (AFM) system and micromachined cantilever probes, we have investigated the relationship between contact forces and the fritting which should be utilized for making contact to IC pads in MEMS probe cards. As a result, it has been clarified that a stable low-resistance contact to Al and Cu films can be obtained without applying contact forces larger than 15 μN, when the applied voltage is larger than 15 V. Also, we have found that then the adhesion forces between the probe and films are less than 45 μN. In addition, the applicability of an electroplated-Ni cantilever probe card to the test of 20-μm-pitch pad IC is discussed.
ISSN:0924-4247
1873-3069
DOI:10.1016/S0924-4247(01)00822-6